JPH0367447U - - Google Patents
Info
- Publication number
- JPH0367447U JPH0367447U JP12911389U JP12911389U JPH0367447U JP H0367447 U JPH0367447 U JP H0367447U JP 12911389 U JP12911389 U JP 12911389U JP 12911389 U JP12911389 U JP 12911389U JP H0367447 U JPH0367447 U JP H0367447U
- Authority
- JP
- Japan
- Prior art keywords
- connects
- semiconductor encapsulation
- members
- gas flow
- encapsulation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 5
- 239000011810 insulating material Substances 0.000 claims 2
- 239000013013 elastic material Substances 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12911389U JPH0367447U (en]) | 1989-11-06 | 1989-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12911389U JPH0367447U (en]) | 1989-11-06 | 1989-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367447U true JPH0367447U (en]) | 1991-07-01 |
Family
ID=31676772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12911389U Pending JPH0367447U (en]) | 1989-11-06 | 1989-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367447U (en]) |
-
1989
- 1989-11-06 JP JP12911389U patent/JPH0367447U/ja active Pending
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